Author: Laura Jiang (page 5)

The Banking, Financial Services and Insurance (#BFSI) Accelerator 2021 is NOW OPEN for registration! We are calling for #FinTech startup and technology ventures specialized in the fields of Blockchain, AI and Robotics, Cybersecurity, InsurTech, WealthTech and RegTech.

Fundamentals of Entrepreneurship Programme by Draper University is open for application.
Application Deadline: 28 April 2021

The Hong Kong Founder Institute runs a 3.5 month startup launch program that provides a step-by-step structure, constant feedback from some of Hong Kong’s top mentors.

A lifestyle innovation platform merging the worlds of design, technology and business, the azalvo Project powered by Jumpstart is defining the future of lifestyle tech, through its new-age value chain and collaborative co-creation community.

HKU SAAS Data Science Lab of the Department of Statistics & Actuarial Science, The University of Hong Kong is organizing an AI robotics vision and automation technology challenges competition for secondary school/undergraduate/graduated students, and companies.

If you’re looking to kickstart innovation inside your organization, the team at Explorium Hong Kong together with over 30 innovation community collaborators co-created a useful open-source Ecosystem Innovation Playbook for launching and running innovation teams and activities.

Funded by SME Development Fund of the Hong Kong Trade and Industry Department, HKSQ and HKQAA are recruiting start-up companies to join a free online research survey until 31 March 2021!

GAA Seamless Journey Accelerator focuses on optimizing sales & marketing, distribution, and total customer experience in the consumer industry.

HKSTP and HSBC are jointly launching the Accelerator to reinvent the manufacturing industry and build sustainable business capabilities. Want to disrupt the manufacturing industry? Apply now!

Mizuho Crowd Brain has started recruiting Cohort #4 startups with the focus on Fintech and Healthtech. Deadline is right around the corner and application spots are limited, apply by Jan 29, 2021.